Process Engineer in Nauen bei Pac Tech – Packaging Technologies GmbH

Work within the team to develop and qualify new products for customers as well as control and maintain processes for existing customer products which are qualified for production

Involve in new process and equipment parameters optimization
– DOE run for process optimisation and parameter windows setting
– Follow up with the preparation of DOE material and machine parts
– Collect process performance data and compile engineering reports
– Equipment conversion and buyoff

Perform engineering build (For customer and qual samples)
– To run process for new product at early stage of engineering build, before handing over to production operator
– To monitor process performance during engineering build thereafter to release to mass production
– Provide training and mentorship to operators

Bachelor Degree in an Engineering or Science Discipline with at least 1-3 years of working experience as a process engineer in semiconductor industry

Fresh Graduates whom are very determined, willing to learn, a fast learner and have the knowledge about semiconductor wafer (and basic know-how on how to handle the wafers) are welcome to apply as well

Hands-on experience in the following process will be given priority consideration:
1. Wet Chemical Etching, e.g. Silicon Etching or Cleaning
2. Metal Evaporation or Sputter (PVD)
3. Wafer thinning
4. Electroless plating
5. Electrochemical deposition (ECD) / Electroplating
6. Photolithography

Have some experiences in technologies like thin film deposition, Cu-RDL or Cu-Pillar, or WLP in general

Good presentation, communication and team working skills

Having “Hands on” attitude and creative problem-solving mind set to get the work done quickly and effectively to meet customers schedules

Ability to work under pressure with minimum supervision

Applicants should be Malaysian citizens or hold relevant residence status

Possess own transport