Working Student – Package Desi in Dresden bei Racyics GmbH

Extending our international team, we are looking for an working student for Package Design.

Job Description:

• You will work within our package design team at layout tasks for package substrates.

Requirements:

• An ongoing study in electrical communication engineering, information technology or RF technology
• Finished intermediate exams or at least 2nd master semester
• Good English communication skills
• Team-player

Good to have skills:

• Work with PCB and substrate design tools by Cadence or Altium
• Basic knowledge in linear network theory
• Time domain and frequency domain modeling of passive conductor structures

Location:

Dresden, Germany

Employment Type:

Working Student

About us:

Racyics® is Europe’s leading design service provider for mixed-signal system-on-chip design and turnkey services in advanced nodes.

We deliver professional analog, digital and mixed-signal design services tailored to the customers’ needs with focus on realization of complex System-on-Chips in leading edge technology nodes. Our team of more than 100 employees covers the complete chip design process up to system architecture development. Racyics is working for major German and international semi-custom companies both as a service provider and in collaborative partnerships.

Working at Racyics comes with many benefits, including flexible working hours, mobile work, a financial contribution to your childcare costs and great team events.

Contact:

Send us a mail with your CV incl. your certificates, transcripts etc. attached to jobs@racyics.com. Please mind that we can only consider attachments in PDF format.