Intern SOI Desi Engineering in München bei Qorvo

Intern SOI Design Engineering (m/f/d)

Qorvo supplies innovative semiconductor solutions that make a better world possible. We serve diverse high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our diverse and innovative team is helping connect, protect and power our planet.

Qorvo Munich GmbH, a subsidiary of QORVO Inc., is looking for a

Intern Analog IC Design Engineering (m/f/d)

Munich, Germany

At Qorvo everything starts with our employees. As a unified global team, we bring commitment to excellence, growth, as well as passion for creating what’s next. As part of the RF Product Design Team, you will have ample opportunities to contribute to research and product related efforts and to submerge yourself in the company culture.

This is a full-time Intern position with a duration of approximately six months and corresponding remuneration. Alternative part time models may be possible, completion of a MS Thesis in the framework of the internship can be supported.

RESPONSIBILITIES:

• Development of RF ICs for 4G/5G mobile handset applications
• Design of analog functional blocks like bandgaps, charge pumps, LDOs, level shifters, OpAmps, etc.
• Support device characterization
• Troubleshoot measurements and RF/analog design issues
• Writing detailed specifications

QUALIFICATIONS:

• Currently enrolled in MS university program for Electrical Engineering
• Focus on analog IC design
• Design and/or layout experience with Cadence
• Basic knowledge of device physics
• Team player in an international work environment
• Very good English language skills, German language is a plus

Please apply online in English at: www.qorvo.com/careers/job-search, Requisition ID: tbd

QORVO Inc., North Carolina, United States, c/o QORVO Munich GmbH, Konrad-Zuse-Platz 1, 81829 München